Huawei unveils Kirin 9050 and 9050 Pro chips with LogicFolding transistor stacking

Huawei has introduced the Kirin 9050 and Kirin 9050 Pro, which stack two layers of circuits to boost transistor density without smaller process nodes, working around US sanctions. The 9050 Pro reaches 238 million transistors per square millimeter, 28% denser than the Kirin 9030, with 31% higher overall performance and 140% more NPU power. It already powers the Mate XT 2, Mate 90 Pro Max and Mate 90 RS.

• Density of 238 million transistors per mm², 28% above Kirin 9030
• 31% higher overall performance, 140% more NPU, 40% faster GPU rendering
• CPU has 9 cores and 16 threads with a 3.1GHz prime core
• Huawei aims to match 1.4nm-class density by 2031