Hardware5 dSeptember 16, 2026, 15:02

Samsung and Qualcomm jointly develop organic bridges for 2.1D packaging

Samsung Electro-Mechanics and Qualcomm are jointly developing an organic bridge for 2.1D chip packaging. The technology aims to improve interconnects between dies in advanced AI and HPC products.

Digitimes Open source

Samsung and Qualcomm jointly develop organic bridges for 2.1D packaging

Samsung Electro-Mechanics and Qualcomm work on organic bridge for 2.1D packaging
Technology targets die interconnects in advanced chips
Development follows growing demand for AI accelerator packaging

#Samsung#Qualcomm

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