SK Hynix resumes DDR4, DDR5 packaging orders with Winpac

SK Hynix has resumed outsourcing DRAM packaging to South Korean OSAT provider Winpac, reviving a supplier relationship that ended in 2023. The move follows growing volumes of flip-chip memory packaging.

• SK Hynix restarts DRAM packaging outsourcing with Winpac
• The supplier relationship had ended in 2023
• Driven by rising flip-chip packaging volumes