China moves 3D DRAM from lab to fab

China's 3D DRAM effort is shifting from early-stage research to wafer processes and equipment. The work involves the Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) and the Beijing Superstring Memory Research Institute (SAMT).

• China's 3D DRAM push moves from research to wafer processes
• IMECAS and Beijing's SAMT are involved in the effort
• Work spans memory technology and manufacturing equipment