CPO ramp pushes silicon photonics testing upstream to catch defects early

Growing demand for optical interconnects in AI servers and the transition of co-packaged optics (CPO) to mass production are shifting silicon photonics testing from component characterization to wafer yield protection and early defect detection.

• CPO enters mass production due to AI server demand for fast optical interconnects
• Photonics testing shifts from component checks to wafer yield control
• Defects targeted for early detection in production