Hardware2 hSeptember 29, 2026, 10:07

HBM to take nearly 30% of DRAM capacity by 2027 as Samsung speeds up P5

High-bandwidth memory is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% now, per Digitimes. Samsung Electronics is accelerating new memory capacity amid tightening supplies of both HBM and conventional DRAM.

Digitimes

Open source

HBM to take nearly 30% of DRAM capacity by 2027 as Samsung speeds up P5

HBM share of DRAM wafer capacity to rise from ~20% to nearly 30% by 2027
Samsung is speeding up new memory capacity, including the P5 site
Drivers are tightening supplies of both HBM and conventional DRAM

#Samsung#HBM#DRAM

CXMT gains ground in DRAM as Samsung, SK Hynix shift capacity to HBM

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CXMT HBM Yield Near 25% as YMTC XStacking Hybrid Bond Enters DRAM Stack Plans

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CXMT cashes in on the DRAM shortage — and takes aim at HBM

Hardware

HBM to take nearly 30% of DRAM capacity by 2027 as Samsung speeds up P5

CXMT gains ground in DRAM as Samsung, SK Hynix shift capacity to HBM

CXMT HBM Yield Near 25% as YMTC XStacking Hybrid Bond Enters DRAM Stack Plans

CXMT cashes in on the DRAM shortage — and takes aim at HBM

CXL adds memory capacity, but HBM retains its bandwidth edge