3D chips push EDA tools beyond single-die design

Growing demand for AI accelerators with 3D stacking and chiplets is forcing EDA tools to co-optimize compute, memory, interconnect, power and thermal constraints. Customers cite vendor interoperability, dynamic floor-planning, IR and STA analysis as pain points, while agentic AI adds a new layer on top of existing tools.

• Hardest AI chip problems now live at system boundaries, not inside the die
• Customers demand interoperability across established EDA vendors and startups
• Agentic AI speeds up design exploration and automates tasks
• Thermal, stress and electrical physics must be considered before design decisions are locked