ZDT prices US$800M convertible bond to expand AI server PCB push

Taiwanese PCB maker Zhen Ding Technology (ZDT) Group completed pricing of its sixth overseas convertible bond on September 22, raising US$800 million (about NT$25.224 billion). The proceeds will fund expansion of its AI server PCB production.

• ZDT raised US$800 million via convertible bonds
• It is the company's sixth overseas convertible bond issue
• Proceeds will expand AI server PCB output
• The amount equals about NT$25.224 billion