Intel reportedly in talks with AUO on advanced packaging

Intel is in talks with Taiwan's AUO on advanced packaging using Micro LED glass substrates for co-packaged optics and high-density computing, per Digitimes. Display makers aim to convert large-format glass processing expertise into semiconductor packaging capabilities.

• Intel and AUO discuss Micro LED glass substrate packaging
• Tech targets co-packaged optics and high-density computing
• Display makers seek entry into semiconductor packaging