Flexcompute raises strategic funding from Samsung Ventures and Applied Ventures

Simulation startup Flexcompute took strategic investment from Samsung Ventures and Applied Ventures, the venture arm of Applied Materials. The bet is on predicting package warpage: an 800,000-solder-joint, 5-billion-degree-of-freedom model solved in minutes within 2% of full finite-element analysis.

• Flexcompute received funding from Samsung Ventures and Applied Ventures
• Model covers 800,000 solder joints and 5 billion degrees of freedom
• Warpage solve takes minutes and stays within 2% of full FEA
• CoWoS interposer area grows from ~5.5 to 14 reticles on the roadmap