UMC and AP Memory partner on DTC silicon capacitors for AI chip power delivery

UMC and AP Memory announced a technology and manufacturing partnership on October 22 to develop next-generation power delivery for AI data centers. The work combines UMC's deep trench capacitor (DTC) technology and wafer manufacturing with AP Memory's advanced packaging solutions.

• UMC and AP Memory announced the partnership on October 22
• The solution uses UMC's DTC capacitors and in-house wafer manufacturing
• Targeted at power delivery for AI chips in data centers
• Focus on advanced chip packaging