Samsung taps Japan for 3.xD chiplet push as packaging race heats up

Samsung Electronics is deepening ties with Japan's semiconductor ecosystem, developing large-format 3.xD chiplet packaging for HPC and AI processors. The company is relying on Japanese materials, equipment, and engineering resources amid intensifying chip packaging race.

• Samsung develops large-format 3.xD chiplet packaging for HPC and AI
• Company relies on Japanese materials, equipment, and engineers
• Goal is to strengthen position in chip packaging race