FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks
Foxconn Interconnect Technology (FIT) reported strong demand for AI optics: capacity is almost fully utilized, with order visibility extending to 2027. The company is in talks with Corning on EBO and with TSMC on co-packaging, diversifying its AI optics bets.
- FIT's AI optics capacity almost fully utilized
- Order visibility extends to 2027
- FIT in talks with Corning on EBO
- Co-packaging with TSMC under discussion
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