SK Nexilis develops high-adhesion carbon-coated copper foil

SK Nexilis has developed carbon-coated copper foil that suppresses volume expansion and delamination in silicon anodes. The company has begun building a pilot line and targets commercialization in the second half of 2027.

• Carbon coating boosts adhesion between foil and anode material
• The foil works with the dry electrode process
• Pilot production is underway at the Jeongeup plant
• Commercialization is planned for the second half of 2027