AI inference-chip startup SUNMMIO raises nearly RMB 2B

Beijing-based SUNMMIO has closed Pre-A2 and Series A rounds led by state-backed investors including Yizhuang State Investment, bringing total funding to nearly RMB 2 billion over the past year. The company builds 3D-stacked chips for large-model inference and will use the funds to expand R&D and ramp production of its 3D TokenPU processors. Its first-generation A4E chip taped out in June with eight memory wafers stacked on a logic wafer and 16 TB/s of memory bandwidth.

• Pre-A2 and Series A led by Beijing state-backed investors
• Nearly RMB 2 billion raised in total over the past year
• First-gen A4E chip completed tape-out in June
• Eight memory wafers on logic deliver 16 TB/s bandwidth