TSMC, Intel, Samsung seek to break AI chipmaking's next barrier via early tech integration

At the October 12 opening of Applied Materials' conference, senior executives from TSMC, Intel and Samsung outlined growing challenges in AI chip development, spanning advanced semiconductor processes, 3D integration and research models. Samsung was represented by Jae-hyuk Song, president and CTO of its DS division.

• TSMC, Intel and Samsung spoke at the Applied Materials conference opening on October 12
• Key topics included advanced processes, 3D integration and research models
• Samsung was represented by DS division president and CTO Jae-hyuk Song
• The companies are pursuing early technology integration to overcome AI chipmaking barriers