Hua Hong signs deals with four Chinese chip equipment suppliers

China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate adoption of locally developed wafer fabrication tools. The company aims to strengthen its share of the specialty foundry market by 2030.

• Hua Hong signed agreements with four Chinese equipment suppliers
• Goal is to speed adoption of locally developed wafer fab tools
• Company targets stronger specialty foundry share by 2030