Intel, Broadcom CEOs warn capital crunch could become AI's biggest bottleneck

Speaking at the DBS Asia Future Forward Conference in Singapore, the CEOs of Intel and Broadcom said access to capital and its rising cost could constrain the AI boom more than shortages of chips, memory or power. Hock Tan expects wafer shortages to ease by 2028–2029, while Lip-Bu Tan said investors increasingly want to see ROI.

• Hock Tan: capital may constrain AI more than chips or power
• Lip-Bu Tan: rising cost of capital and ROI doubts weigh on the industry
• Wafer shortages could ease by 2028–2029
• Compute infrastructure demand outpaces supply through 2029–2030