BofA: ASML's chip packaging push threatens Besi shares

Bank of America analysts said BE Semiconductor's share price does not reflect the threat from fellow Dutch company ASML in advanced chip packaging. ASML's move into the technique could pressure Besi's position, they said.

• BofA: Besi share price ignores ASML threat
• Focus is on advanced chip packaging technology
• Both companies are based in the Netherlands