Extreme environments push chips to their breaking point

Orbital data centers, military and aerospace systems, quantum computing and lithography demand chips that survive radiation, thermal shock, vibration and cryogenic temperatures. Designers rely on 4D modeling, AI-assisted design exploration and lab tools such as ASU's Rigel DSTAT with 9,000 curies of radioactive material.

• Demand for rad-hard processes is rising with orbital data centers and the Golden Dome initiative
• Fermilab and Siemens' AXESS project uses LLMs to speed chip design for quantum and physics applications
• ASU built the Rigel DSTAT test rig with 9,000 curies for radiation tests at 77 K
• PNNL and partners' Rads to Watts program develops strontium-90 micropower sources lasting decades